Size reduction of chip mounting system
AssigneeNEC Corporation
InventorsShinji Watanabe, Masashi Tsunabuchi
Life of this patent
Estimating the term…
Abstract
A chip mounting system includes a substrate supply apparatus and a chip supply apparatus. The substrate supply apparatus includes a transport conveyor formed to be moved for a length corresponding to the size of a discrete substrate and a stage with a disposition surface corresponding to the size of the discrete substrate. In the chip supply apparatus, the lowermost chip tray of a plurality of stacked chip trays is sequentially transported to a chip supply stage, and a tray stage is disposed near the chip supply stage. In addition, the chip supply apparatus includes a box for surrounding an area in which the substrate and the chip are transported as a substantially closed space and a clean fan for flowing clean air into the closed space.
Claims5
A method of supplying a substrate comprising the step of:
- supplying a substrate on which a chip is to be mounted to a chip mounting apparatus in the form of a discrete substrate or an independent unit substrate consisting of a plurality of discrete substrates.
An apparatus for supplying a substrate on which a chip is to be mounted to a chip mounting apparatus, comprising:
- a transport conveyor for transporting a substrate carrier for holding a discrete substrate or an independent unit substrate consisting of a plurality of discrete substrates, or a substrate for multiple devices consisting of a number of discrete substrates, and for feeding said substrate carrier or said substrate for multiple devices for a length corresponding to the size of said discrete substrate;
- a stage having a disposition surface corresponding to the size of said discrete substrate;
- and
- holding means for removably holding above said stage said unit substrate in said substrate carrier or said substrate for multiple devices transported by said transport conveyor to a position above said stage.
An apparatus for supplying a chip to a chip supply stage of a chip mounting apparatus, comprising:
- a tray stage disposed near said chip supply stage for holding chip trays stacked in a plurality of layers, each of said chip trays holding a plurality of chips;
- tray holding means for holding the second chip tray from the bottom of said chip trays stacked in layers to separate the lowermost chip tray from said held second chip tray;
- and
- transport means for transporting said lowermost chip tray separated from said second chip tray from the bottom by said tray holding means to said chip supply stage.
Dependencies are inferred from the claim text.