Method and apparatus for mounting components

A component mounting apparatus, comprising:

• a component supply section for supplying electronic components;
• a mounting head having suction nozzles for picking up the electronic components from said component supply section and mounting the electronic components on a printed circuit board;
• a component mounting section for positioning and fixing said printed circuit board;
• a control section for controlling operations of said suction nozzles, the mounting head and the component mounting section;
• and
• a data section containing information on the components to be mounted,
• wherein the positions of the suction nozzles, the mounting head and the printed circuit board are driven and controlled so that the components are mounted in ascending, order of height based on height data on the components to be mounted, said height data being supplied from said data section.

A component mounting apparatus, comprising:

• a component supply section that supplies electronic components;
• a mounting head having a plurality of suction nozzles placed in a circular form for picking up the electronic components from said component supply section and mounting the electronic components on a printed circuit board;
• a component mounting section for positioning and fixing said printed circuit board;
• a control section for controlling vertical movements of said suction nozzles, intermittent rotations of the mounting head and horizontal movements of the component mounting section;
• and
• a data section containing information on the components to be mounted,
• wherein the movements of the suction nozzles, the mounting head and the printed circuit board are driven and controlled so that the components are mounted in ascending order of height based on height data on the components to be mounted, said height data being supplied from said data section.

A component mounting apparatus, comprising:

• a component supply section for supplying electronic components;
• a mounting head having suction nozzles for picking up the electronic components from said component supply section and mounting the electronic components on a printed circuit board;
• a component mounting section for positioning and fixing said printed circuit board;
• a control section for controlling vertical movements of said suction nozzles and horizontal movements of the mounting head;
• and
• a data section containing information on the components to be mounted,
• wherein the movements of the suction nozzles and the mounting head are driven and controlled so that the components are mounted in ascending order of height based on height data on the components to be mounted, said height data being supplied from said data section.