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AssigneeMosel Vitelic, Inc.
InventorsHsiao-Chi Lou, Ween-Chen Lu
Estimating the term…
A method for locating wiring swap in a hi-fix structure of a simultaneous multi-electronic device test system is introduced to screen the complicated wiring state of the hi-fix structure and to pinpoint the wiring swap thereinside as well. The hi-fix structure has at least S socket slots for testing electronic devices which each of the electronic devices has at least R leads. The present method, firstly, is to prepare R test unit sets which each of the test unit set includes S identical lead-off elements. Then, all R test unit sets are tested, in order, on the hi-fix structure and the respective test results are recorded. Finally, by analyzing the test results, the wiring swap inside the hi-fix structure can be accurately located.
A method for locating wiring swap in a hi-fix structure of a simultaneous multi-electronic device test system, the hi-fix structure including at least S socket slots, each of the socket slots configured to receive a device with at least R leads, the method comprising:
A test unit set for locating wiring swap in a hi-fix structure of a simultaneous multi-electronic device test system, the test unit set comprising:
A standard test set for locating wiring swap in a hi-fix structure of a simultaneous multi-electronic device test system, the standard test set comprising:
Dependencies are inferred from the claim text.