Ultrasonic probe and method for fabricating the probe
AssigneeKabushiki Kaisha Toshiba
InventorsMasaaki Sudo, Susumu Hiki, Shinichi Sato, Taihei Sato
Life of this patent
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Abstract
A piezoelectric transducer for sending and receiving an ultrasonic wave and an FPC for applying current to the piezoelectric transducer is provided, the FPC is arranged oppositely to a side face of the piezoelectric transducer, and a soldering material for electrically connecting the piezoelectric transducer to the FPC is arranged in a corner portion formed by the piezoelectric transducer and the FPC.
Claims20
An ultrasonic probe comprising;
- a piezoelectric transducer for sending and receiving an ultrasonic wave,
- and a conductive substrate for applying current to the piezoelectric transducer,
- wherein the conductive substrate is arranged oppositely to a side face of the piezoelectric transducer,
- and a conductive material is arranged in a corner portion formed by the piezoelectric transducer and the conductive substrate, the material electrically connecting the piezoelectric transducer to the conductive substrate.
An ultrasonic probe comprising;
- a piezoelectric transducer for sending and receiving an ultrasonic wave,
- a first conductive substrate having a signal wiring for applying current to the piezoelectric transducer,
- and a second conductive substrate having an earth wiring for connecting to the piezoelectric transducer,
- wherein the first conductive substrate is arranged oppositely to a first side face of the piezoelectric transducer,
- the second conductive substrate is arranged oppositely to a second side face of the piezoelectric transducer,
- the earth wiring is electrically connected to a first electrode formed on a first main-face side of the piezoelectric transducer by a conductive material arranged in a first corner portion formed by the first conductive substrate,
- and the signal wiring is electrically connected to a second electrode formed on a second main-face side of the piezoelectric transducer by a conductive material arranged in a second corner portion formed by the second conductive substrate.
In a fabrication method of an ultrasonic probe for fabricating the ultrasonic probe having a piezoelectric transducer for sending and receiving an ultrasonic wave, and a conductive substrate for applying current to the piezoelectric transducer, the method comprising;
- a disposing process for disposing the conductive substrate oppositely to a side face of the piezoelectric transducer,
- a supplying process of a conductive material for supplying the conductive material to a corner portion formed by the piezoelectric transducer and the conductive substrate,
- and a heating process for electrically connecting the piezoelectric transducer to the conductive substrate by heating the conductive material.
Dependencies are inferred from the claim text.