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US 2004/0167258 A1Published application
Hot melt adhesive composition
OwnerCecile Drogou, Gwenaelle Allandrieu +2inventors
InventorsCecile Drogou, Gwenaelle Allandrieu, Justin A. Mehaffy, Jagruti B. Patel
Life of this patent
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Abstract
A low application temperature comprising an ethylene n-butyl acrylate copolymer that can be applied at temperatures down to about 80° C. or less and is useful in case and carton sealing application.
Claims13
A hot melt adhesive that can be applied to a substrate at a temperature of less than about 110° C., said adhesive comprising an ethylene copolymer, a paraffin wax, a rosin derived tackifier and an aromatic tackifier.
The packaged article of claim 12 which is a packaged food article.
Dependencies are inferred from the claim text.