Planarizing pads for planarization of microelectronic substrates
AssigneeMicron Technology, Inc.
InventorsVishnu K. Agarwal, Dinesh Chopra
Life of this patent
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Abstract
A planarizing pad for planarizing a microelectronic substrate, and a method and apparatus for forming the planarizing pad. In one embodiment, planarizing pad material is mixed with compressed gas to form a plurality of discrete elements that are distributed on a support material. At least a portion of the discrete elements are spaced apart from each other on the support material to form a textured surface for engaging a microelectronic substrate and removing material from the microelectronic substrate. The discrete elements can be uniformly or randomly distributed on the support material, and the discrete elements can be directly affixed to the support material or affixed to the support material with an adhesive.
Claims72
A method for forming a textured planarizing pad for planarizing a microelectronic substrate, comprising:
- separating a planarizing pad material into discrete elements;
- and
- disposing the discrete elements on a support material with portions of the discrete elements spaced apart from each other and projecting from the support material and with the discrete elements configured to engage the microelectronic substrate and remove material from the microelectronic substrate.
A method for forming a textured planarizing pad for planarizing a microelectronic substrate, comprising:
- distributing a plurality of abrasive elements in a liquid planarizing pad material;
- mixing the liquid planarizing pad material with a gas stream to form a jet of pad material droplets;
- directing the jet of pad material droplets toward a support material;
- distributing the pad material droplets over the support material by moving at least one of the support material and the jet relative to the other;
- and
- solidifying the pad material droplets and securing the pad material droplets to the support surface of the support material by curing the pad material droplets and the support material.
A method for forming a textured planarizing pad for planarizing a microelectronic substrate, comprising:
- providing a support material having a first surface and a second surface opposite the first surface;
- and
- forming texture elements at least proximate to the first surface of the support material without engaging a mold or die with the support material, at least a portion of the texture elements spaced apart from each other with the texture elements having a raised portion configured to engage a microelectronic substrate and remove material from the microelectronic substrate when at least one of the texture elements and the microelectronic substrate is moved relative to the other.
A planarizing pad for planarizing a microelectronic substrate, comprising:
- a generally planar support portion;
- and
- a plurality of texture elements disposed on the support portion, portions of the texture elements being spaced apart from each other and projecting from the support portion, each texture element having a generally smooth upper surface, smoothly transitioning to a generally smooth side surface without asperities.
A planarizing pad for planarizing a microelectronic substrate, comprising:
- a support portion;
- and
- a plurality of discrete texture elements disposed on the support portion, the texture elements being initially separate from the support portion and subsequently bonded to the support portion with portions of the texture elements being spaced apart from each other and projecting from the support portion, each texture element having a generally smooth upper surface.
An apparatus for forming a planarizing pad for mechanically and/or chemically-mechanically planarizing a microelectronic substrate, comprising:
- a support device configured to support a pad support material in a selected position;
- a vessel configured to contain a non-solid planarizing pad material;
- and
- at least one nozzle operatively coupled to the vessel and coupled to a source of compressed gas, the nozzle configured to mix the planarizing pad material with the compressed gas to form discrete texture elements for disposing on the support material.
Dependencies are inferred from the claim text.