Polishing pad conditioning
AssigneeIntel Corporation
InventorsReza M. Golzarian, Mansour Moinpour
Life of this patent
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Abstract
An apparatus for conditioning a polishing pad of a CMP apparatus for making semiconductor wafers is provided which includes a control arm configured to extend at least partially over a polishing pad. The apparatus also includes at least one cylindrical conditioning piece coupled to the control arm where the control arm is configured to apply the at least one cylindrical conditioning piece to the polishing pad.
Claims24
An apparatus for conditioning a polishing pad of a CMP apparatus for making semiconductor wafers, comprising:
- a control arm configured to extend at least partially over the polishing pad;
- and
- at least one cylindrical conditioning piece coupled to the control arm, the control arm configured to apply the at least one cylindrical conditioning piece to the polishing pad.
A method for conditioning a polishing pad surface of a polishing pad of a CMP apparatus for making semiconductor wafer, comprising:
- providing a cylindrical conditioning piece to the CMP apparatus;
- rotating the cylindrical conditioning piece about a longitudinal axis of the cylindrical conditioning piece;
- and
- applying the rotating cylindrical polishing pad to the polishing pad surface.
A system for conditioning a polishing pad, comprising:
- a polishing pad holder;
- a polishing pad coupled to the polishing pad holder;
- an arm;
- and
- a cylindrical conditioning piece coupled to the arm, the arm being configured to apply the cylindrical conditioning piece to the polishing pad.
Dependencies are inferred from the claim text.