Polishing apparatus and method

An outer periphery polishing apparatus for polishing an outer peripheral portion of a substrate, comprising:

• a substrate holder for holding a substrate so as to allow an outer peripheral portion of the substrate to be exposed;
• a polishing unit having a polishing surface that is located so as to face the outer peripheral portion of the substrate while the substrate is held by said substrate holder;
• a rotating mechanism for rotating at least one of said substrate holder and said polishing unit;
• and
• a moving mechanism for moving at least one of said substrate holder and said polishing unit to bring said substrate holder and said polishing unit into engagement with each other and to separate said substrate holder and said polishing unit from engagement with each other;
• wherein said polishing unit is rotatable about a rotational axis, and includes a polishing liquid supply port around said rotational axis for supplying a polishing liquid to said polishing surface via centrifugal force caused by rotation of said polishing unit about said rotational axis.

A polishing apparatus for polishing a workpiece, comprising:

• a surface polishing mechanism for polishing a surface of a workpiece, said surface polishing mechanism including a polishing table having a polishing surface and a top ring for holding the workpiece and pressing the workpiece against said polishing surface of said polishing table;
• and
• an outer periphery polishing unit having an outer periphery polishing surface for polishing an outer peripheral portion of the workpiece;
• wherein said outer periphery polishing unit is rotatable about a rotational axis, and includes a polishing liquid supply port around said rotational axis for supplying a polishing liquid to said outer periphery polishing surface via centrifugal force caused by rotation of said outer periphery polishing unit about said rotational axis.

A polishing method for polishing a workpiece having a film formed thereon, said polishing method comprising:

• polishing a surface of a workpiece by pressing said surface of said workpiece against a polishing surface of a polishing table under a predetermined force;
• polishing an outer peripheral portion of said workpiece before or after said polishing of said surface of said workpiece by pressing said outer peripheral portion of said workpiece against an outer periphery polishing surface of a rotating outer periphery polishing unit;
• and
• directing a polishing liquid to said rotating outer periphery polishing unit about a rotational center thereof such that said polishing liquid is supplied to said outer periphery polishing surface via centrifugal force caused by the rotation of said outer periphery polishing unit.

An outer periphery polishing apparatus for polishing an outer peripheral portion of a substrate having a film formed thereon, said outer periphery polishing apparatus comprising:

• a substrate holder for holding a substrate so as to allow an outer peripheral portion of the substrate to be exposed;
• a polishing unit having a polishing surface that is located so as to face the outer peripheral portion of the substrate while the substrate is held by said substrate holder;
• a rotating mechanism for rotating at least one of said substrate holder and said polishing unit;
• and
• a moving mechanism for moving at least one of said substrate holder and said polishing unit to bring said substrate holder and said polishing unit into engagement with each other and to separate said substrate holder and said polishing unit from engagement with each other;
• wherein said polishing unit is rotatable about a rotational axis, and includes a polishing liquid supply port around said rotational axis for supplying a polishing liquid to said polishing surface via centrifugal force caused by rotation of said polishing unit about said rotational axis.

A polishing apparatus for polishing a workpiece having a film formed thereon, said polishing apparatus comprising:

• a surface polishing mechanism for polishing a surface of a workpiece, said surface polishing mechanism including a polishing table having a polishing surface and a top ring for holding the workpiece and pressing the workpiece against said polishing surface of said polishing table;
• and
• an outer periphery polishing unit having an outer periphery polishing surface for polishing an outer peripheral portion of the workpiece;
• wherein said outer periphery polishing unit is rotatable about a rotational axis, and includes a polishing liquid supply port around said rotational axis for supplying a polishing liquid to said outer periphery polishing surface via centrifugal force caused by rotation of said outer periphery polishing unit about said rotational axis.

A polishing method for polishing a workpiece, comprising:

• polishing a surface of a workpiece by pressing said surface of said workpiece against a polishing surface;
• polishing an outer peripheral portion of said workpiece before or after said polishing of said surface of said workpiece by pressing said outer peripheral portion of said workpiece against an outer periphery polishing surface of a rotating outer periphery polishing unit;
• and
• directing a polishing liquid to said rotating outer periphery polishing unit about a rotational center thereof.