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US 2004/0166772 A1Published application
Method of reducing thermal distortion in grinding machines
AssigneeUnova U.K. Limited
InventorMichael George Pierse
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AssigneeUnova U.K. Limited
InventorMichael George Pierse
Estimating the term…
The invention provides a method of reducing thermal distortion in grinding machines. Such machines each comprise a machine base (60) and a grinding wheel (50) for grinding components in the machine (10). The method includes the steps of: (a) sensing a first temperature at an upper surface of the base (60) substantially below a position (110) in the machine (10) whereat component grinding using the wheel (50) occurs; (b) sensing a second temperature of an underside surface of the base (60) substantially below the position (110) whereat component grinding occurs; (c) determining a relationship between component size drift and changes in a difference between the first and second temperatures; and thereafter (d) correcting a positional offset applied to the wheel (50) during grinding in accordance with the determined relationship, thereby reducing the component size drift. Preferably, the relationship is substantially a linear function of the form MDS=Kf(ΔT1−ΔT2) although higher-order polynomial correction can be applied if required. The invention also relates to grinding machines (10) employing the method of reducing thermal distortion.
A method of reducing thermal distortion in a grinding machine comprising a machine base and a grinding wheel for grinding components in the machine, the method including the steps of:
A method according to any preceding claim wherein the first temperature is measured using a probe which is substantially thermally isolated from any coolant fluid flowing over the upper exterior surface of the base.
A method according to any preceding claim wherein the first temperature is measured using a probe which is in thermal communication by mediation of a heat conductive paste with the upper surface of the base.
A method according to any preceding claim wherein the second temperature is measured using a probe magnetically attached to the underside surface of the base.
A method according to any preceding claim wherein the position whereat component grinding occurs and the positions at which the first and second temperatures are measured are mutually substantially co-linear.
A method according to any preceding claim wherein the relationship is of the form
A method according to any preceding claim wherein the first and second temperatures are measured to a resolution of at least 0.1° C.
Dependencies are inferred from the claim text.