High speed, high density interconnection device
AssigneeAdvanced Interconnections Corporation, a Rhode Island corporation
InventorsMichael N. Perugini, Gary D. Eastman, Alfred J. Langon, Raymond A. Prew, Erol D. Saydam
Life of this patent
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Abstract
An intercoupling component for receiving an array of contacts includes a non-conductive substrate having a plurality of holes disposed on its upper surface and arranged in a predetermined footprint corresponding to the array of contacts. Contacts are disposed within the holes and a cavities, which may be open to air or filled with some other dielectric material, are disposed in the substrate between adjacent contacts.
Claims58
An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and a chassis ground circuit, the intercoupling component comprising:
- a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint corresponding to the array of a contacts;
- and
- a shield member formed of electrically conductive material and at least partially disposed within the segment and configured to electrically connect to the chassis ground circuit.
An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and a chassis ground circuit, the intercoupling component comprising:
- a plurality of segments formed of electrically insulative material, spaces between adjacent segments defining at least one gap, each segment having an upper and lower surface and including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint corresponding to the array of a contacts;
- and
- a shield member formed of electrically conductive material disposed within at least one gap between adjacent segments and configured to electrically connect with the chassis ground circuit of the system.
An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and a chassis ground circuit, the intercoupling component comprising:
- a segment formed of electrically insulative material and having an upper and lower surface, the segment including plurality of holes disposed on its upper surface and arranged in a predetermined footprint corresponding to the array of a contacts;
- and
- a plurality of electrically conductive contacts each disposed within each hole on the upper surface of the segment, wherein the plurality of contacts are arranged in a plurality of multi-contact groupings, at least one multi-contact grouping comprising:
- a first electrically conductive contact;
- and
- a reference contact located at a distance D from the first electrically conductive contact and configured to electrically connect to the electrical ground circuit of the system.
A circuit card for use in a digital or analog transmission system having an electrical ground circuit and a chassis ground circuit, the circuit card comprising:
- a printed circuit board having a plurality of contact pads arranged in a predetermined footprint;
- and
- an interconnection device comprising:
- a segment having an upper and lower surface, the segment having a plurality of holes extending through the upper and lower surfaces and arranged in a predetermined footprint to match the predetermined footprint of the plurality of surface mount pads;
- a plurality of electrically conductive contact member disposed within each of the holes and electrically connected to their respective surface mount pad;
- a shield member formed of electrically conductive material disposed within the segment;
- a frame formed of electrically conductive material surrounding the segment, the frame electrically connected the shield member and to the chassis ground circuit of the system.
An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit, the intercoupling component comprising:
- a segment formed of a material having a dielectric constant Er1, and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint corresponding to the array of a contacts;
- a first signal contact disposed within a first hole on the segment;
- and
- a second signal contact disposed within a second hole on the segment adjacent to the first hole in which the first signal contact is disposed, and wherein a cavity is formed in the segment between the first and second hole.
A method for adjusting the differential impedance of a pair of differential transmission lines in a interconnection device for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit, the intercoupling component comprising, the method comprising:
- providing a segment formed of a material having a dielectric constant Er1 and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface;
- providing a pair of signal contacts disposed within two adjacent holes on the segment, the pair of signal contacts configured to transmit differential signals;
- spacing the pair of signal contacts such that they create a certain differential impedance between the two contacts in the pair of signal contacts;
- and
- providing a cavity in the segment between the two signal contacts in the pair of signal contacts to adjust the differential impedance between the pair of signal contacts.
Dependencies are inferred from the claim text.