Semiconductor device having external contact terminals and method for using the same
AssigneeShinko Electric Industries Co., Ltd.
InventorMitsutoshi Higashi
Life of this patent
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Abstract
A method is provided, for using a semiconductor device having a plurality of external contact terminals (20) formed of springy wires, which is usable in a stable state free from the variation of contact voltage for a long period even if the contact terminal repeats the contact several hundreds or thousands times. A tip end of the external contact terminal (20) is plated with removable multiple films (23, 24), and the plated films are removed by an etching treatment, in accordance with the degree of contamination of the tip end of the external contact terminal, and then the external contact terminal is rinsed to be reusable.
Claims8
A semiconductor device comprising:
- a substrate body;
- a plurality of external contact terminals formed of springy wires, said external terminals arranged on and extending from said substrate body;
- each of said external contact terminals having a base end connected to said substrate body and a tip end apart from said base end;
- and
- each of said external contact terminals being plated, at least, or said tip end thereof with multiple-layered films which are removable by an etching treatment.
A semiconductor device comprising:
- a substrate body;
- a plurality of external contact terminals formed of springy wires, said external terminals arranged on and extending from said substrate body;
- each of said external contact terminals having a base end connected to said substrate body and a tip end apart from said base end;
- an insulating resin layer formed on said substrate body in such a manner that at least a portion including said tip end is exposed from said insulating resin layer;
- and
- each of said external contact terminals being plated at least said exposed portion thereof with multiple films which are removable by an etching treatment.
A method of using a semiconductor device, said device a substrate body;
- a plurality of external contact terminals formed of springy wires, said external terminals arranged on and extending from said substrate body;
- each of said external contact terminals having a base end connected to said substrate body and a tip end apart from said base end;
- and each of said external contact terminals being plated at least said tip end thereof with multiple films which are removable by an etching treatment;
- said method comprising:
- removing said plated film by an etching treatment in accordance with a degree of contamination of the tip end;
- and
- rinsing this semiconductor device to reuse the same.
Dependencies are inferred from the claim text.