Method of fabrication of semiconductor integrated circuit device
AssigneeRenesas Technology Corp.
InventorsTakayuki Wakabayashi, Toshiyuki Uchino, Yasuo Kiguchi, Atsuyoshi Koike
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Abstract
The conveyance of wafers in bays (equipment groups) of a clean room is performed by RGVs (Rail Guided Vehicles) that linearly travel on conveying rails (3) laid on the floor of the clean room at high speed. A structure is adopted wherein a conveying area over which the RGV travels, is separated from a human working area by a compartment (partition) (4), and a human does not enter the conveying area upon operation of a line.
Claims20
wherein the tracks for the RGVs are laid on substantially straight lines:
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(Amended) The fabrication method according to claim 2, wherein the bay-to-bay conveyance of the wafers is performed via a track mounted to a ceiling in the clean room.
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Dependencies are inferred from the claim text.