Dynamically adjustable slurry feed arm for wafer edge profile improvement in CMP

A method for adjusting a slurry feeder arm position in a chemical mechanical polishing (CMP) process comprising the steps of:

• a) carrying out a firs CMP polishing period including supplying slurry from a slurry arm including a dispensing position for a predetermined period of time on a substrate comprising a polishing layer to remove a portion of a polishing layer;
• b) determining the thickness of the polishing layer in-situ along the polishing layer diameter comprising at least a polishing layer peripheral portion and a polishing layer center portion;
• c) determining a desired subsequent dispensing position in a subsequent CMP polishing period in response to a thickness difference of the polishing layer peripheral portion compared to the polishing layer center portion;
• and,
• d) adjusting the slurry feed arm to the subsequent dispensing position such that the slurry is dispensed over the polishing pad at the subsequent dispensing position comprising one of closer to the polishing pad center portion in the case the polishing layer center portion is thicker than the polishing layer peripheral portion and closer to the polishing pad peripheral portion in the case the polishing layer peripheral portion is thicker than the polishing layer center portion.