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US 2004/0166676 A1Published application
Method and apparatus for forming damascene structure, and damascene structure
OwnerTetsunori Kaji, Yoichi Uchimakiinventors
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OwnerTetsunori Kaji, Yoichi Uchimakiinventors
Estimating the term…
An apparatus for creating a conductive damascene by filling copper in a plug portion formed on an insulating film, the apparatus comprising an etching chamber 151A for etching a low-k material, a vacuum transfer chamber 153 for transferring in vacuum a sample being etched, a receiving means for receiving the transferred sample, a voltage application means, a copper barrier processing chamber 151B for performing a copper barrier process by reforming the surface of the sample through carbonizing process, nitriding process, brominating process, boride-forming process, reduction process, amorphous-forming process or a combination thereof, which is realized by making ions accelerated by voltage or neutral particles obtained by diselectrifying the accelerated ions collide against the etched surface, and a high vacuum processing chamber 151C where copper is filled in the plug portion having the etched surface with a copper barrier.
A conductive damascene structure formed by filling copper in a plug portion formed on an insulating film, the plug portion having a copper barrier layer formed to reach a depth of 3 nm to 50 nm from the surface of side wall portions and plane portions defining an inner wall of the plug portion, and having copper filled in the plug portion.
A conductive damascene structure formed by filling copper in a plug portion formed on an insulating film, the plug portion having on its inner wall a two-step trench portion comprising a large cross-section and a small cross-section via a plane portion, the plug portion having a copper barrier layer formed to reach a depth of 3 nm to 50 nm from the surface of side wall portions and plane portions defining the inner wall of the plug portion, and having copper filled in the plug portion.
A sample having a conductive damascene structure formed thereto by filling copper in a plug portion formed on an insulating film, the plug portion having a width of 0.1 μm or smaller with a copper barrier layer formed to reach a depth of 3 nm to 50 nm from the surface of its side wall portions and plane portions defining an inner wall of the plug portion, and having copper filled in the plug portion provided with the barrier layer.
A sample having a conductive damascene structure formed thereto by filling copper in a plug portion formed on an insulating film, the plug portion having a width of 0.1 μm or smaller with a copper barrier layer formed to reach a depth of 5 nm to 30 nm from the surface of its side wall portions and plane portions defining an inner wall of the plug portion, and having copper filled in the plug portion provided with the barrier layer.
Dependencies are inferred from the claim text.