Manufacturing method of electro line for semiconductor device
OwnerOh-Nam Kwoninventor
Life of this patent
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Abstract
A method of manufacturing an electro line for a semiconductor device includes depositing a molybdenum (Mo) layer on a substrate, depositing a copper layer (Cu) on the Mo layer, forming a photoresist pattern on the Cu layer, etching the Cu layer and the Mo layer using an etchant to form a Mo/Cu electro line, wherein the photoresist pattern is used as a patterning mask, and removing Mo residue around the Mo/Cu line to reduce short circuits between electro-lines and leakage current in the thin-film transistor.
Claims16
A method of manufacturing an electro line for a semiconductor device, comprising:
- depositing a molybdenum (Mo) layer on a substrate;
- depositing a copper layer (Cu) on the Mo layer;
- forming a photoresist pattern on the Cu layer;
- etching the Cu layer and the Mo layer using an etchant to form a Mo/Cu electro line, wherein the photoresist pattern is used as a patterning mask;
- and
- removing Mo residue around the Mo/Cu electro line.
A method of manufacturing a liquid crystal display device including a Mo/Cu electro line, comprising:
- forming a gate line and a gate electrode, including:
- depositing a molybdenum (Mo) layer on a substrate;
- depositing a copper layer (Cu) on the Mo layer;
- forming a photoresist pattern on the Cu layer;
- etching the Cu layer and the Mo layer using an etchant to form a Mo/Cu electro line, wherein the photoresist pattern is used as a patterning mask;
- and
- removing Mo residue around the Mo/Cu electro line;
- forming a gate insulating layer on the gate line and the gate electrode;
- forming a semiconductor layer on the gate insulating layer over the gate electrode;
- forming a data line, a source electrode and a drain electrode on the semiconductor layer;
- forming a passivation layer on the data line, the source electrode and the drain electrode;
- and
- forming a pixel electrode on the passivation layer.
Dependencies are inferred from the claim text.