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US 2004/0166670 A1Published application
Method for forming three-dimensional structures on a substrate
AssigneeInfineon Technologies AG
InventorsAxel Brintzinger, Ingo Uhlendorf
Life of this patent
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Abstract
A method of forming a resist layer on a non-planar surface of a substrate includes placing the non-planar surface into an electrophoretic resist. While the non-planar surface is in the electrophoretic resist, an electrical voltage is applied between the substrate and the electrophoretic resist. The non-planar surface can then be removed from the electrophoretic resist.
Claims22
A method of forming a resist layer on a non-planar surface of a substrate, the method comprising:
- providing a substrate having a non-planar surface;
- placing the non-planar surface into an electrophoretic resist;
- while the non-planar surface is in the electrophoretic resist, applying an electrical voltage between the substrate and the electrophoretic resist;
- and
- removing the non-planar surface from the electrophoretic resist.
2 more elements
A method for forming a plurality of three-dimensional structures on a substrate, the method comprising:
- providing a wafer with bumps distributed on a surface of the wafer;
- and
- forming a resist over the surface of the wafer including the bumps by coating the surface of the wafer with an electrophoretic resist by dipping the surface of the wafer into the resist and by applying an electrical voltage between the wafer and the electrophoretic resist.
Dependencies are inferred from the claim text.