Method for constructing a wafer-interposer assembly
AssigneeEaglestone Partners I, LLC
InventorJerry D. Kline
Life of this patent
Estimating the term…
Abstract
A method for reducing the likelihood of damaging a semiconductor wafer (18) and the integrated circuit chips of the semiconductor wafer (18) during handling utilizes a wafer interposer (12) having a wafer receiving portion (28) and a handling portion (30). The wafer receiving portion (28) of the wafer interposer (12) has a plurality of contact pads (22) that are electrically and non-temporarily mechanically connected to the contact pads of the integrated circuit chips of the wafer (18). The handling portion (30) of the wafer interposer (12) extends outwardly from the wafer receiving portion (28) such that the handling portion (30) is accessible to handling equipment without the handling equipment contacting the attached wafer (18).
Claims26
A method for constructing a wafer-interposer assembly comprising the steps of:
- providing a wafer having a plurality of integrated circuit chips each having a plurality of contact pads;
- and
- connecting the wafer to a wafer receiving portion of a wafer interposer to form a wafer-interposer assembly by electrical and non-temporary mechanical connection of at least some of the contact pads of the integrated circuit chips with contact pads of the wafer receiving portion, the wafer interposer having a handling portion extending outwardly from the wafer receiving portion.
A method for reducing the likelihood of damaging a wafer during handling comprising the steps of:
- providing a wafer having a plurality of integrated circuit chips each having a plurality of contact pads;
- connecting the wafer to a wafer receiving portion of a wafer interposer to form a wafer-interposer assembly by electrical and non-temporary mechanical connection of at least some of the contact pads of the integrated circuit chips with contact pads of the wafer receiving portion;
- and
- accessing a handling portion of the wafer interposer that is operably associated with the wafer receiving portion without contacting the wafer.
A method for constructing chip assemblies comprising the steps of:
- providing a wafer having a plurality of integrated circuit chips each having a plurality of contact pads;
- connecting the wafer to a wafer receiving portion of a wafer interposer to form a wafer-interposer assembly by electrical and non-temporary mechanical connection of at least some of the contact pads of the integrated circuit chips with contact pads of the wafer receiving portion;
- accessing a handling portion of the wafer interposer that extends outwardly from the wafer receiving portion without contacting the wafer;
- separating the handling portion of the wafer interposer from the wafer interposer;
- and
- singulating the wafer-interposer assembly into a plurality of chip assemblies, each chip assembly including at least one of the integrated circuit chips and a portion of the wafer interposer.
Dependencies are inferred from the claim text.