Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument
AssigneeSeiko Epson Corporation
InventorKoji Yamaguchi
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a semiconductor substrate in which an integrated circuit is formed and which includes interconnects and electrodes, the interconnects electrically connected with the semiconductor substrate, and the electrodes being formed on the interconnects; a resin layer formed on the semiconductor substrate; redistribution interconnects electrically connected with the electrodes; a plurality of external terminals which are formed on the redistribution interconnects and supported by the resin layer; and a plurality of dummy terminals supported by the resin layer without being electrically connected with the electrodes.
Claims20
A semiconductor device comprising:
- a semiconductor substrate in which an integrated circuit is formed and which includes interconnects and electrodes, the interconnects electrically connected with the semiconductor substrate, and the electrodes being formed on the interconnects;
- a resin layer formed on the semiconductor substrate;
- redistribution interconnects electrically connected with the electrodes;
- a plurality of external terminals which are formed on the redistribution interconnects and supported by the resin layer;
- and
- a plurality of dummy terminals supported by the resin layer without being electrically connected with the electrodes.
A semiconductor device comprising:
- an interposer substrate on which a semiconductor chip is surface-mounted;
- an interconnect layer formed on a back surface of the interposer substrate;
- a dummy bump which is formed on the back surface of the interposer substrate and disposed in an outermost region of the interposer substrate;
- an external terminal which is disposed closer to a center of the interposer substrate than the dummy bump and connected with the interconnect layer;
- and
- a through-hole which is formed in the interposer substrate and connects the semiconductor chip with the interconnect layer.
A method of manufacturing a semiconductor device comprising:
- forming a resin layer on a semiconductor substrate in which an integrated circuit is formed and which includes interconnects and electrodes, the interconnects electrically connected with the semiconductor substrate, and the electrodes being formed on the interconnects;
- forming redistribution interconnects so as to be electrically connected with the electrodes;
- forming a plurality of external terminals on the redistribution interconnects so as to be supported by the resin layer;
- and
- forming a plurality of dummy terminals so as to be supported by the resin layer without being electrically connected with the electrodes.
Dependencies are inferred from the claim text.