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AssigneeS.O.I.Tec Silicon on Insulator Technologies
InventorsSebastien Kerdiles, Yves-Mathieu Le Vaillant
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A tool for disuniting two wafers, at least one of which is for use in fabricating substrates for microelectronics, optoelectronics, or optics, the tool comprising two gripper members suitable for being fixed temporarily to respective opposite faces of the two wafers that are united with each other, and a disuniting control device suitable for moving said members relative to each other. The tool is remarkable in that the disuniting control device comprises an actuator for positively displacing said gripper members and for inducing controlled flexing in at least one of said members. This makes it easier to disunite the wafers while reducing the risk of damaging them. The invention is applicable to disuniting wafers that have been weakened by implantation, that have been temporarily bonded together, etc.
A tool for disuniting two wafers, with at least one of the wafers being used in fabricating substrates for microelectronics, optoelectronics, or optics, the tool comprising two gripper members for temporarily affixing to respective opposite faces of the wafers that are united to each other, and a disuniting control device suitable for moving the members relative to each other, wherein the disuniting control device comprises an actuator device for positively displacing the gripper members sufficiently for inducing controlled flexing in at least one of the members to assist in disuniting the wafers.
A method of disuniting two wafers, with at least one of the wafers being used in fabricating substrates for microelectronics, optoelectronics, or optics, the method comprising the following steps:
A method of measuring the bonding energy between two wafers, with at least one of the wafers being used in fabricating substrates for microelectronics, optoelectronics, or optics, the method comprising the following steps:
Dependencies are inferred from the claim text.