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US 2004/0166603 A1Published application
Micromachined assembly with a multi-layer cap defining a cavity
OwnerL. Richard Carleyinventor
Life of this patent
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Abstract
This invention comprises a process for fabricating a micro mechanical structure in a sealed cavity having a multi-layer high strength cap. The high strength material used for the cap protects the underlying microstructure from destructive environmental forces inherent in the packaging process and from environmental damage.
Claims136
A method of creating a sealed cavity on a wafer comprising the steps of:
- depositing one or more layers of a sacrificial material on said wafer and shaping said sacrificial material;
- depositing a first cap layer on said one or more layers of sacrificial material;
- removing said one or more layers of sacrificial material such that said first cap layer and the portion of said wafer underlying said first cap layer define said cavity;
- and
- depositing one or more additional cap layers on said first cap layer, said one or more additional cap layers being formed of a high strength material:
- wherein said one or more additional cap layers contact said wafer.
3 more elements
A micro-sealed cavity comprising:
- a wafer;
- a cap structure covering at least a portion of said wafer, said cap structure contacting said wafer to define a cavity thereunder;
- wherein said cap structure is composed of a high strength material.
In a wafer for containing a microstructure, an improvement comprising:
- depositing one or more layers of high strength material over said microstructure to define a cavity between said wafer and said one or more layers of high strength material.
A method of fabricating an encapsulated micromachined assembly, comprising the steps of:
- providing a substrate;
- depositing a first layer of sacrificial material on said substrate;
- forming a microstructure of a desired shape on said first layer of sacrificial material;
- depositing a second layer of sacrificial material on said first layer of sacrificial material, said second layer covering said microstructure;
- depositing a first cap layer on top of said first and said second layers of sacrificial material;
- removing said first and said second layers of sacrificial materials;
- and
- depositing one or more additional cap layers on top of said first cap layer, said one or more additional cap layers being formed of a high strength material having a relatively high stiffness.
5 more elements
A MEMS device comprising:
- a substrate;
- a microstructure formed on said substrate;
- a cap covering said microstructure;
- and
- one or more additional layers of high strength material covering said cap.
2 more elements
A micromachined assembly comprising:
- a substrate having a support surface on one side and a base surface on a side opposite said support surface;
- a cap layer extending from points on said support surface disposed about a region of interest on said support surface and including a portion overlying said region of interest;
- a cap overlayer extending from said support surface and disposed over and contiguous with said cap layer;
- whereby said cap layer and said cap overlayer and said support surface define a closed capsule about an interior region containing said region of interest;
- and
- wherein said cap overlayer is characterized by a relatively high stiffness with respect to said cap layer.
3 more elements
A micromachined assembly, comprising:
- a substrate having a support surface on one side and a base surface on a side opposite said support surface;
- a microstructure disposed on said support surface;
- a sputter-deposited cap layer extending from points on said support surface and disposed over at least a portion of said microstructure, said cap layer and said device support surface defining a capsule about an interior region containing said microstructure, said cap layer being formed of a material characterized by a relatively high stiffness.
A microstructure comprising:
- a wafer,
- a cap, said cap contacting said wafer around a closed perimeter to define a cavity between said wafer and said cap;
- wherein said cap is composed of a plurality of layers.
A method of creating a sealed micro cavity on a wafer comprising the steps of:
- depositing one or more layers of a sacrificial material on said wafer;
- depositing a plurality of cap layers over said sacrificial material, said individual ones of said plurality of cap players being defined by a change in one or more deposition parameters or a change in material between one layer and the next.
Dependencies are inferred from the claim text.