Promoting adhesion between a polymer and a metallic substrate
AssigneeInternational Business Machines Corporation
InventorsAnastasios P. Angelopoulos, Stephen Joseph Fuerniss, Joan Cangelosi, Joseph Alphonse Kotylo, Luis Jesus Matienzo, Norman L. Shaver
Life of this patent
Estimating the term…
Abstract
A structure comprising a metallic surface, a layer of a polymeric material and a water soluble polymeric material located between the metallic surface and the layer of polymeric material, and process of fabricating such are provided. The structure exhibits enhanced adhesion between the metallic surface and the polymeric material.
Claims37
A structure comprising a metallic surface, a layer of a first polymeric material and a layer of a water soluble polymeric material located between the metallic surface and the first polymeric material.
A process for fabricating a structure which comprises the steps of providing a metallic surface, providing a water soluble cationic polymeric material on the metallic surface, and then providing a layer of a non-water soluble polymeric material on the water soluble polymeric material.
A process for fabricating an electronic package which comprises providing a substrate and a metallic conductive layer on the substrate, providing a water soluble polymeric material located on the conductive layer, then providing a photoactive polymeric film on the water soluble polymeric material, then imagewise exposing the photoactive polymeric material to actinic light, and developing by removing photoactive polymeric film.
Dependencies are inferred from the claim text.