Color conversion filter substrate, color conversion type multicolor display having the same, and method of manufacturing the same
OwnerMakoto Utsumi, Koji Kawaguchiinventors
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Abstract
A color conversion filter substrate includes a transparent support substrate; a single type or a plurality of types of color conversion filter layers formed of a resin film containing a fluorescent colorant and formed on the support substrate in a desired pattern; a polymeric layer formed of a transparent material and having a flat surface for covering the color conversion filter layer; and a transparent inorganic layer formed on the polymeric layer. The inorganic layer contains silicon and at least one of oxygen and nitrogen and has a hydrogen-to-silicon atomic ratio less than 1.
Claims6
A color conversion filter substrate, comprising:
- a transparent support substrate,
- at least one color conversion filter layer formed of a resin film containing a fluorescent colorant and formed on the support substrate in a desired pattern,
- a polymeric layer having a flat surface and formed of a transparent material for covering the at least one color conversion filter layer and a surface of the transparent support substrate on which the color conversion filter layer is formed, and
- a transparent inorganic layer formed on the polymeric layer and containing silicon and at least one of oxygen and nitrogen, said inorganic layer having a hydrogen-to-silicon atomic ratio less than 1.
A method of manufacturing a color conversion filter substrate, comprising the steps of:
- preparing a transparent support substrate,
- forming at least one color conversion filter layer formed of a resin film containing a fluorescent colorant on the support substrate in a desired pattern, covering the at least one color conversion filter layer and the transparent support substrate with a polymeric layer formed of a transparent material to be flat, and
- forming a transparent inorganic layer formed of silicon and at least one of oxygen and nitrogen with a hydrogen-to-silicon atomic ratio less than 1 on the polymeric layer, wherein the inorganic layer is formed by using a plasma CVD method at a temperature of less than 200° C., using raw material gases containing at least a gas selected from the group consisting of silane and tetraethoxysilane, and a gas selected from the group consisting of nitrogen, ammonia, oxygen, nitrogen oxide and carbon dioxide.
Dependencies are inferred from the claim text.