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AssigneeWorld Properties, Inc.
InventorsMurali Sethumadhavan, Vincent R. Landi, Bruce G. Kosa
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An electrical circuit material having a conductive layer disposed a substrate, wherein the substrate is formed from a thermosetting composition comprising a polybutadiene or polyisoprene resin; an optional, functionalized liquid polybutadiene or polyisoprene resin; an optional butadiene- or isoprene-containing copolymer; an optional low molecular weight polymer; an optional curing agent; a cross-linking agent; a particulate fluoropolymer; and about 20 to about 50 percent by weight, based on the total weight of the thermosetting composition, of a magnesium hydroxide having a low ionic content. Use of magnesium hydroxide allows the composition to attain a high level of flame retardancy without use of halogenated flame retardants, while maintaining good moisture absorption and other physical properties.
An electrical circuit material comprising a conductive layer disposed a substrate, wherein the substrate is formed from a thermosetting composition comprising:
The electrical circuit material of claim 16, wherein the conductive layer is copper.
A substrate for an electrical circuit material, wherein the substrate comprises a thermosetting composition comprising:
A method of making an electrical circuit substrate material, the method comprising
Dependencies are inferred from the claim text.