Molding compositions containing quaternary organophosphonium salts
AssigneeHenkel Loctite Corporation
InventorsAnthony A Gallo, Mark T. Dimke
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AssigneeHenkel Loctite Corporation
InventorsAnthony A Gallo, Mark T. Dimke
Estimating the term…
Molding compositions particularly useful in coating electronic devices such as integrated circuits are disclosed. The molding compositions include an epoxy resin; a hardener for the epoxy resin, a flame retardant compound such as melamine cyanurate, and a quaternary organophosphonium salt for catalyzing a reaction between the epoxy resin and the hardener, such as ethyl triphenyl phosphonium acid acetate. The molding compositions exhibit improved flame retardancy. Also, when multifunctional epoxy resins and multifunctional phenolic hardeners such as those derived from phenol with a degree of branching of at least three are used, the molding compounds including the quaternary organophosphonium salt as a catalyst exhibit long flow and low shrinkage and warpage.
A composition comprising:
A flame retardant molding composition, comprising:
A molding composition, comprising:
A molding composition, comprising:
A method of providing a flame retardant polymer composition comprising:
A method of coating an electrical or electronic device comprising heating an epoxy molding composition to a temperature sufficient to cure the molding composition and form a polymer on a surface of the device, the molding composition comprising an epoxy resin, a crosslinking agent for the epoxy resin, a cyanurate functional compound and a quaternary organophosphonium salt.
A method of coating an electrical or electronic device with a long flow, low shrinkage encapsulant, comprising heating an epoxy molding composition to a temperature sufficient to cure the molding composition and form a polymer on a surface of the device, the molding composition comprising a multifunctional epoxy resin derived from phenol and having a degree of branching of at least three, a multifunctional phenolic hardener having a degree of branching of at least three, and a quaternary organophosphonium salt for catalyzing a reaction between the epoxy resin and the phenolic hardener.
Dependencies are inferred from the claim text.