Sintering method for W-Cu composite material without exuding of Cu
AssigneeAgency for Defense Development
InventorsEun-Pyo Kim, Moon-Hee Hong, Joon-Woong Noh, Seoung Lee, Sung-Ho Lee, Young-Do Kim, Dae-Gun Kim
Life of this patent
Estimating the term…
Abstract
Disclosed is a densification process of a W—Cu composite material, and more particularly, a sintering method for a W—Cu composite material without exuding of Cu. The sintering method comprises the steps of: holding a W—Cu composite power compact for a certain time at a Cu solid phase temperature or at a temperature just above a melting point and thus inducing a nearly complete densification; and sintering for a short time at a Cu liquidus temperature.
Claims3
A sintering method for a W—Cu composite material without exuding of Cu comprising the steps of:
- holding a W—Cu composite material prepared by compacting a W—Cu composite powder for 0.5˜10 hours at 800˜1083° C. (except 1083° C.) which is a Cu solid phase temperature range under a reduction atmosphere;
- and
- increasing temperature to 1200˜1400° C. and thereby cooling without a holding time.
A sintering method for a W—Cu composite material without exuding of Cu comprising the steps of holding a W—Cu composite material prepared by compacting a W—Cu composite powder for 0.5˜10 hours at 1083˜1150° C. which is just above a Cu melting point under a reduction atmosphere;
- and
- increasing temperature to 1200-1400° C. and thereby cooling without a holding time.
Dependencies are inferred from the claim text.