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US 2004/0165634 A1Published application
Flip-chip automatically aligned optical device
AssigneeTyco Electronics Corporation
InventorsTansen Varghese, William Ring
Life of this patent
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Abstract
A semiconductor laser device with a first side and a second side, comprising (a) an active region, (b) a P layer, wherein the P layer contains a first contact area, (c) an N layer, wherein said N layer contains a second contact area, wherein the contact area of the first contact area of the P layer and the second contact layer of the N layer reside on the first side of the laser device.
Claims10
A optical semiconductor device with a first side and a second side, comprising:
- an active region;
- a P layer, wherein said P layer contains at least one first contact area;
- and
- an N layer wherein said N layer contains at least one second contact area;
- and
- wherein said at least one contact area and said at least one second contact area reside on said first side of said laser device.
3 more elements
A method for attaching a optical semiconductor device to an optical bench, comprising:
- 1) providing at least one first contact area and at least one second contact area on a first side of said device;
- 2) providing at least one first bond pad on said at least one first contact area;
- 3) providing at least one second bond pad on said at least one second contact area;
- 4) placing said device on said optical bench wherein said at least one first bond pad and said at least one second bond pad are approximately aligned to said optical bench;
- 5) performing a re-flow process on said at least one first bond pad and said at least one second bond pad to create a bond between said device and said optical bench.
2 more elements
Dependencies are inferred from the claim text.