Chip scale package structures and method of forming conductive bumps thereon
AssigneeMicron Technology, Inc.
InventorWarren M. Farnworth
Life of this patent
Estimating the term…
Abstract
A sealing layer is provided on the surface of a substrate such as a semiconductor wafer. The sealing layer includes apertures which expose external contact locations for semiconductor dice formed on the wafer. Solder paste is deposited in the apertures and reflowed to form discrete conductive elements for attachment of the electronic devices to higher level circuit structures. The wafer is then divided or “singulated” to provide individual semiconductor dice having their active surfaces covered by the sealing layer. In this manner, the sealing layer initially acts as a stencil for forming the discrete conductive elements, and subsequently forms a chip scale package structure to protect the semiconductor dice from the environment.
Claims44
An electronic device package comprising:
- a substrate including at least one electronic device with at least one external contact location on a surface thereof;
- a mask layer over the surface of the substrate surrounding the at least one external contact location;
- a sealing layer over the mask layer having an aperture therethrough exposing the at least one external contact location and a portion of the mask layer surrounding the at least one external contact location;
- and
- a discrete conductive element attached to the at least one external contact location and extending outwardly from the surface of the substrate to a distance beyond the sealing layer.
A method of forming an electronic device package comprising:
- providing a substrate bearing at least one electronic device;
- providing at least one external contact location on a surface of the substrate;
- forming a mask layer over the surface of the substrate and surrounding the at least one external contact location;
- forming a sealing layer over the mask layer with an aperture exposing the at least one external contact location and a portion of the mask layer surrounding the at least one external contact location;
- depositing a conductive material within the aperture exposing the at least one external contact location;
- and
- forming the conductive material into a discrete conductive element attached to the at least one external contact location and extending outwardly from the surface of the substrate to a distance beyond the sealing layer.
Dependencies are inferred from the claim text.