[package structure compatible with cooling system]
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsTSUNG-YUEH TSAI, SHENG-YANG PENG
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Abstract
The present invention relates to a package structure compatible with a cooling system, the package structure comprising a carrier, a chip, a mold compound and a cooling tubule that can be connected to a cooling system. The chip is arranged on the carrier and electrically connected to the carrier, while the mold compound covers the chip and one surface of the carrier. The cooling tubule is disposed either within the mold compound or on an outer surface of the mold compound. The cooling tubule is connected to a cooling tubing of the cooling system and a fluid driven by a pump circulates in the cooling tubing and the cooling tubule for heat dissipation.
Claims12
A package structure that is compatible with a cooling system, comprising:
- a carrier;
- at least a chip, arranged on the carrier and electrically connected to the carrier;
- a mold compound, covering the chip and one surface of the carrier;
- and
- a cooling tubule disposed within the mold compound, wherein the cooling tubule is connected to the cooling system, wherein the cooling system is a closed system and a fluid driven by a pump circulates within the cooling tubule and the cooling system.
A package structure that is compatible with a cooling system, comprising:
- a carrier;
- at least a chip, arranged on the carrier and electrically connected to the carrier;
- a mold compound, covering the chip and one surface of the carrier;
- and
- a cooling tubule disposed on an outer surface of the mold compound, wherein the cooling tubule is connected to the cooling system, wherein the cooling system is a closed system and a fluid driven by a pump circulates within the cooling tubule and the cooling system.
Dependencies are inferred from the claim text.