Sandwich holographic disk construction with thin molded substrates
AssigneeImation Corp.
InventorsJathan D. Edwards, Frank E. Aspen, Ramon F. Hegel, Chad R. Sandstrom
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Abstract
In one embodiment, holographic data storage medium includes a first thermoplastic substrate portion having a thickness less than approximately 2 millimeters and a second thermoplastic substrate portion having a thickness less than approximately 2 millimeters. A holographic recording material may be sandwiched between the first and second thermoplastic substrate portions. By making thermoplastic substrate portions sufficiently thin, edge wedge problems can be avoided.
Claims21
A holographic data storage medium comprising:
- a first injection molded thermoplastic substrate portion having a thickness less than approximately 2 millimeters and greater than 0.5 millimeters,
- a second injection molded thermoplastic substrate portion having a thickness less than approximately 2 millimeters and greater than 0.5 millimeters, and
- a holographic recording material between the first and second injection molded thermoplastic substrate portions.
A holographic data storage system comprising:
- a laser that produces at least one laser beam;
- optical elements through which the laser beam passes;
- a data encoder that encodes data in at least part of the laser beam;
- a holographic recording medium that stores at least one hologram, the holographic recording medium comprising:
- a first injection molded thermoplastic substrate portion having a thickness less than approximately 2 millimeters and greater than 0.5 millimeters,
- a second injection molded thermoplastic substrate portion having a thickness less than approximately 2 millimeters and greater than 0.5 millimeters, and
- a holographic recording material between the first and second injection molded thermoplastic substrate portions.
A holographic data storage medium having a thickness less than approximately 5 millimeters, and greater than approximately 2.0 millimeters, the holographic data storage medium including injection molded thermoplastic substrates each having a thickness less than approximately 2 millimeters and greater than 0.5 millimeters.
Dependencies are inferred from the claim text.