Method of fluid ejection
OwnerNaoto Kawamura, Marvin G. Wonginventors
Life of this patent
Estimating the term…
Abstract
A fluid ejection method for selectively depositing fluid on printing media is provided. The method includes providing a carrier configured to receive a fluid ejecting substrate. The fluid ejecting substrate has an orifice layer, first planar surface and a contact surface positioned below the first planar surface. Inserting the fluid ejecting substrate into the carrier and forming an electrical coupling between the contact surface of the fluid ejecting substrate and the carrier are included in the method. The method further includes providing a mold for dispensing an encapsulant on top of the electrical coupling to form a substantially co-planar surface with the fluid ejecting substrate and an upper surface of the carrier.
Claims4
A fluid ejection method for selectively depositing fluid on printing media, the method comprising:
- providing a carrier configured to receive a fluid ejecting substrate, the fluid ejecting substrate comprising an orifice layer, first planar surface and a contact surface positioned below the first planar surface;
- inserting the fluid ejecting substrate into the carrier;
- forming an electrical coupling between the contact surface of the fluid ejecting substrate and the carrier;
- and
- providing a mold for dispensing an encapsulant on top of the electrical coupling to form a substantially co-planar surface with the fluid ejecting substrate and an upper surface of the carrier.
Dependencies are inferred from the claim text.