Solid state imaging device, semiconductor wafer, optical device module, method of solid state imaging device fabrication, and method of optical device module fabrication

An optical device module comprising:

• a lens;
• a lens retainer for retaining said lens;
• and a solid state imaging device;
• wherein
• said solid state imaging device comprises:
• a solid state image pickup device having an effective pixel region in one surface thereof;
• a light-transparent cover arranged opposite to said effective pixel region and having planar dimensions smaller than those of said solid state image pickup device;
• and
• an adhering section for adhering said solid state image pickup device and said light-transparent cover;
• and wherein
• said light-transparent cover is arranged opposite to said lens and inside said lens retainer.

A method of solid state imaging device fabrication, comprising the steps of:

• forming a plurality of solid state image pickup devices each having an effective pixel region in one surface thereof, onto a semiconductor wafer;
• adhering a light-transparent cover having planar dimensions smaller than those of said solid state image pickup device, in a manner opposite to said effective pixel region onto said one surface;
• and
• dividing a plurality of said solid state image pickup devices onto each of which said light-transparent cover has been adhered, into individual solid state image pickup devices.

A method of solid state imaging device fabrication, comprising the steps of:

• forming a plurality of solid state image pickup devices each having an effective pixel region in one surface thereof, onto a semiconductor wafer;
• adhering a light-transparent plate onto said one surface of said semiconductor wafer;
• dividing said light-transparent plate having been adhered onto said semiconductor wafer, so as to form light-transparent covers each being opposite to said effective pixel region;
• and
• dividing a plurality of said solid state image pickup devices into individual solid state image pickup devices.

An optical device module comprising:

• a wiring board on which wiring is formed;
• an image processor adhered to said wiring board and electrically connected to said wiring;
• a solid state imaging device in which a light-transparent cover having planar dimensions smaller than those of a solid state image pickup device is attached opposite to the effective pixel region of said solid state image pickup device, and which is adhered to said image processor and electrically connected to said wiring;
• and
• an optical path defining unit arranged opposite to said solid state imaging device and defining an optical path to said solid state imaging device.

An optical device module comprising:

• a solid state imaging module component formed by resin-sealing:
• a module component wiring board on which wiring is formed;
• an image processor adhered to said module component wiring board and electrically connected to said wiring;
• and a solid state imaging device in which a light-transparent cover having planar dimensions smaller than those of a solid state image pickup device is attached opposite to the effective pixel region of said solid state image pickup device, and which is adhered to said image processor and electrically connected to said wiring;
• in a state that the surface of said light-transparent cover is exposed;
• and
• an optical path defining unit arranged opposite to said solid state imaging device and defining an optical path to said solid state imaging device.

An optical device module comprising:

• a wiring board on which wiring is formed;
• an image processor adhered to said wiring board and electrically connected to said wiring;
• a solid state imaging device in which a light-transparent cover having planar dimensions smaller than those of a solid state image pickup device is attached opposite to the effective pixel region of said solid state image pickup device, and which is adhered to said image processor and electrically connected to said wiring;
• a sealing section for resin-sealing said wiring board, said image processor, and said solid state imaging device in a state that the surface of said light-transparent cover is exposed;
• and
• an optical path defining unit arranged opposite to said solid state imaging device and defining an optical path to said solid state imaging device.

A method of optical device module fabrication comprising the steps of:

• adhering an image processor to a wiring board on which wiring is formed, and then connecting the connection terminals of said image processor to said wiring;
• adhering a solid state imaging device in which a light-transparent cover having planar dimensions smaller than those of a solid state image pickup device is attached opposite to the effective pixel region of said solid state image pickup device, to said image processor, and then connecting the connection terminals of said solid state imaging device to said wiring;
• and
• positioning said solid state imaging device and an optical path defining unit for defining an optical path to said solid state imaging device.

A method of optical device module fabrication comprising the steps of:

• adhering an image processor to a module component wiring board on which wiring is formed, and then connecting the connection terminals of said image processor to said wiring;
• adhering a solid state imaging device in which a light-transparent cover having planar dimensions smaller than those of a solid state image pickup device is attached opposite to the effective pixel region of said solid state image pickup device, to said image processor, and then connecting the connection terminals of said solid state imaging device to said wiring;
• resin-sealing said module component wiring board, said image processor, and said solid state imaging device in a state that the surface of said light-transparent cover is exposed, and thereby forming a solid state imaging module component;
• and
• positioning said solid state imaging device and an optical path defining unit for defining an optical path to said solid state imaging device.

A method of optical device module fabrication comprising the steps of:

• adhering an image processor to a wiring board on which wiring is formed, and then connecting the connection terminals of said image processor to said wiring;
• adhering a solid state imaging device in which a light-transparent cover having planar dimensions smaller than those of a solid state image pickup device is attached opposite to the effective pixel region of said solid state image pickup device, to said image processor, and then connecting the connection terminals of said solid state imaging device to said wiring;
• resin-sealing said wiring board, said image processor, and said solid state imaging device in a state that the surface of said light-transparent cover is exposed, and thereby forming a sealing section;
• and
• positioning said solid state imaging device and an optical path defining unit for defining an optical path to said solid state imaging device.