US 2004/0164755 A1 · Circuit pattern inspection device, circuit pattern inspection method, and recording medium

Abstract

Disclosed is an circuit-pattern inspection apparatus comprising a power supply element 30 adapted to be capacitively coupled with a parallel array of conductive patterns 20 to supply an inspection signal to one end of each of the conductible patterns, an open sensor 40 adapted to be capacitively coupled with all of the other ends of the conductive patterns to detect the inspection signal, and a short sensor 50 arranged at a position displaced from the power supply element 30 and adapted to be capacitively coupled with two lines of the conductive patterns to detect the inspection signal. The quality of the conductive pattern is inspected such that the presence of disconnection is determined when the detect signal from the open sensor 40 is largely reduced, and the presence of short is determined when the detect signal from the short sensor 50 largely rises and then falls. The circuit-pattern inspection apparatus can detect defects in a circuit board reliably and readily.

Claims18

Dependent claims

An apparatus for inspecting a parallel array of conductive patterns formed on a board, comprising:

inspection-signal supply means for supplying an inspection signal to one of the ends of selected one of said conductive patterns;
first detection means for detecting said inspection signal from the other end of said selected conductive pattern;
second detection means for detecting said inspection signal from at least two of the adjacent conductive patterns different from said selected conductive pattern;
and
determination means for determining the state of said selected conductive pattern in accordance with variations in first and second inspection signals detected, respectively, from said first and second detection means.

2 more elements

An apparatus for inspecting a parallel array of conductive patterns formed on a board, comprising:

inspection-signal supply means for supplying an inspection signal to one of the ends of selected one of said conductive patterns;
first detection means for detecting said inspection signal from the other end of said selected conductive pattern;
second detection means for detecting said inspection signal from at least two of the conductive patterns adjacent to said selected conductive pattern;
moving means for moving said first and/or second detection means relative to said conductive patterns to allow said first and/or second detection means to sequentially scan said conductive patterns;
and
determination means for determining the state of said conductive patterns in accordance with variations in first and second inspection signals detected, respectively, from said first and second detection means in conjunction with said relative movement according to said moving means.

3 more elements

A method for inspecting a parallel array of conductive patterns formed on a board, comprising:

supplying an inspection signal to one of the ends of selected one of said conductive patterns;
detecting a first inspection signal from the other end of said selected conductive pattern, and detecting a second inspection signal from at least two of the conductive patterns adjacent to said selected conductive pattern;
and
sequentially scanning said conductive patterns while changing the position for detecting said first and/or second inspection signals to determine the state of said conductive patterns in accordance with variations in said first and/or second inspection signals in conjunction with the change in said canning position.

1 more element

Dependencies are inferred from the claim text.

Circuit pattern inspection device, circuit pattern inspection method, and recording medium

Life of this patent

Circuit pattern inspection device, circuit pattern inspection method, and recording medium

Life of this patent

Abstract

Claims18