Semiconductor sensing device using different resistance types
AssigneeDenso Corporation
InventorsSeiji Hettori, Noboru Endo
Life of this patent
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Abstract
A semiconductor sensing device has a semiconductor substrate with a pressure sensing bridge circuit including piezo-resistance elements formed on the substrate. Further, the semiconductor sensing device has a temperature sensing bridge circuit including resistance elements formed on the semiconductor substrate. A pair of the resistance elements is connected with a power supply terminal, and the other pair of the resistance elements is connected with a grounding terminal. The resistance elements in either or both of these pairs are formed of different resistance types from each other and of the same conductivity type.
Claims6
A semiconductor sensing device comprising:
- a semiconductor substrate;
- and
- a temperature sensing bridge circuit including resistance elements formed on the semiconductor substrate,
- wherein the resistance elements in either or both of a pair of the resistance elements connected with a power supply terminal in the temperature sensing bridge circuit and a pair of the resistance elements connected with a grounding terminal are formed of different resistance types from each other and of the same conductivity type.
A semiconductor sensing device comprising:
- a semiconductor substrate;
- and
- a temperature sensing bridge circuit including resistance elements formed on the semiconductor substrate,
- wherein the resistance elements in either or both of a pair of the resistance elements connected with a power supply terminal in the temperature sensing bridge circuit and a pair of the resistance elements connected with a grounding terminal are divided into first divided resistance elements and second divided resistance elements,
- the four divided resistance elements manufactured by the division of a pair of the resistance elements are positioned at vertexes of a virtual rectangle, and further the first divided resistance element and the second divided resistance element of one resistance element are positioned on a diagonal line and the first divided resistance element and the second divided resistance element of the other resistance element are positioned on another diagonal line.
Dependencies are inferred from the claim text.