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AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsJunichi Hibino, Choujurou Yamamitsu, Hiroyuki Yonehara, Yoshiki Sasaki, Katuyoshi Yamashita, Nobuyuki Kirihara, Kazuo Ootani, Yuusuke Takada, Hideaki Yasui, Ryuichi Murai, Hidetaka Hiagshino, Nobuaki Nagao, Masafumi Ookawa, Hiroyosi Tanaka
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Barrier ribs 18 formed on a back substrate PA2 are brought into contact with a bonding paste layer 40 having an even surface, applying a bonding agent Bd evenly to the tops of the barrier ribs. Furthermore, a gas discharge panel having a structure in which discharge mainly occurs at locations distanced from parts of the panel connected using the bonding agent Bd is realized.
A display panel manufacturing method, comprising an application process for applying a bonding agent to a plurality of barrier ribs formed on at least one of a pair of substrates, and a connection process for arranging the pair of substrates in opposition and connecting the pair of substrates together via the bonding agent that has been applied to the barrier ribs, wherein the application process includes:
A display panel manufacturing method, for connecting a pair of substrates arranged in opposition via (1) a plurality of barrier ribs formed in a specific pattern on at least one of the substrates and (2) a bonding agent arranged on the barrier ribs, the display panel manufacturing method comprising a barrier rib pattern forming process and a bonding agent pattern forming process, including:
A display panel manufacturing method, for connecting a pair of substrates arranged in opposition, via a bonding agent, which has been applied to a plurality of barrier ribs formed in a specific pattern on at least one of the substrates, the display panel manufacturing method comprising:
A display panel manufacturing method, for connecting a pair of substrates arranged in opposition via a bonding agent arranged on a plurality of barrier ribs formed in a specific pattern on at least one of the substrates, the display panel manufacturing method comprising:
A display panel manufacturing method, for connecting a pair of substrates arranged in opposition via a bonding agent arranged on a plurality of barrier ribs formed in a specific pattern on at least one of the substrates, wherein a process for arranging the bonding agent on the barrier ribs includes:
A display panel manufacturing method, for connecting a pair of substrates arranged in opposition via a bonding agent applied to a plurality of barrier ribs formed on at least one of the substrates, wherein a process for arranging the bonding agent on the barrier ribs includes:
A display panel manufacturing method, for connecting a pair of substrates arranged in opposition via a plurality of barrier ribs formed on at least one of the substrates, and a bonding agent applied to the barrier ribs, the display panel manufacturing method comprising:
A gas discharge panel, including a first substrate, on which a plurality of pairs of electrodes extending in a first direction, and a dielectric layer covering the electrodes have been formed, and a second substrate, on which a plurality of barrier ribs, extending in a second direction differing from the first direction, are formed in opposition to the dielectric layer and the electrode pairs so that the barrier ribs are separated from the dielectric layer and the electrode pairs, wherein the dielectric layer and the barrier ribs are at least partially connected;
A display panel, formed from a pair of substrates arranged in opposition and connected via a bonding agent applied to a plurality of barrier ribs formed on at least one of the substrates, the bonding agent being applied to at least part of each barrier rib;
A display panel, formed from a pair of substrates arranged in opposition and connected via a bonding agent applied to a plurality of barrier ribs formed on at least one of the substrates, the bonding agent being applied to at least part of each barrier rib,
Dependencies are inferred from the claim text.