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US 2004/0164432 A1Published application
Cascaded die mountings with spring-loaded contact-bond options
AssigneeUT-Battelle, LLC
InventorsJohn S. Hsu, Donald J. Adams, Gui-Jia Su, Laura D. Marlino, Curtis W. Ayers, Chester Coomer
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Abstract
A cascaded die mounting device and method using spring contacts for die attachment, with or without metallic bonds between the contacts and the dies, is disclosed. One embodiment is for the direct refrigerant cooling of an inverter/converter carrying higher power levels than most of the low power circuits previously taught, and does not require using a heat sink.
Claims36
An interconnect and mounting device comprising;
- at least three cascaded layers of electronic components,
- a means for electrically interconnecting said layers at contact points,
- a means for connecting input power to said device,
- a means for connecting output power to said device,
- wherein said components modify said input power to produce said output power, and
- wherein said components are cooled by direct refrigerant contact.
3 more elements
A method for interconnecting and mounting electronic components comprising the steps of;
- assembling at least three cascaded layers of electronic components,
- providing a means for electrically interconnecting said layers at contact points,
- providing a means for connecting input power to said device,
- providing a means for connecting output power to said device,
- modifying said input power with said electronic components to produce said output power, and
- cooling said components by direct refrigerant contact.
3 more elements
Dependencies are inferred from the claim text.