Circuit device and method of manufacture thereof
AssigneesSanyo Electric Co., Ltd., Kanto Sanyo Semiconductors Co., Ltd.
InventorNoriaki Sakamoto
Life of this patent
Estimating the term…
Abstract
A circuit device 10 comprises a die pad 11, bonding pads 12, a circuit element 9, affixed onto die pad 11, and an insulating resin 14, which seals die pad 11, bonding pads 12, and circuit element 9, and has a configuration wherein recessed parts 15 are formed at parts of the side surfaces of insulating resin 14, and side surface of the conductive patterns that are disposed at peripheral parts are exposed from recessed parts 15. By bonding pads 12, which are to become connecting electrodes to the exterior, being exposed at the side surfaces, fillets of a brazing material 19 are formed at the sides of the device when circuit device 10 is mounted.
Claims18
A circuit device comprising:
- conductive pattern;
- circuit element, affixed onto the conductive patterns;
- and an insulating resin, sealing the conductive pattern and the circuit element while exposing at least the bottom surface of the conductive pattern;
- wherein recessed part is formed at the side surface of the insulating resin, and side surface of the conductive pattern that is disposed at peripheral parts is exposed from the recessed part.
A circuit device manufacturing method comprising:
- preparing a conductive foil and forming separation grooves that are shallower than the thickness of the conductive foil at least at region of the conductive foil except region to be conductive pattern that form a plurality of mounting portions for circuit elements;
- affixing the circuit element onto the respective mounting portions of the conductive pattern;
- performing molding with an insulating resin so as to cover the circuit element at the respective mounting portions in a batch and fill the separation groove;
- removing the back surface of the conductive foil until the insulating resin is exposed;
- removing the conductive patterns at locations corresponding to boundary of the respective mounting portions to form grooves and thereby expose side surface of the conductive patterns;
- and
- performing separation by dicing the insulating resin along the boundary.
A circuit device manufacturing method comprising:
- preparing a conductive foil;
- forming separation groove that is shallower than the thickness of the conductive foil at least at region of the conductive foil except region to be conductive patterns that form a plurality of mounting portions for circuit elements;
- affixing the circuit element onto the respective mounting portions of the conductive pattern;
- performing molding with an insulating resin so as to cover the circuit element at the respective mounting portions in a batch and fill the separation grooves;
- removing the remaining thickness part of the separation grooves to electrically separate the conductive patterns and removing the conductive foil at locations corresponding to boundary of the respective mounting portions to form grooves and thereby expose side surface of the conductive pattern;
- and
- performing separation by dicing the insulating resin along the boundary.
Dependencies are inferred from the claim text.