Chip carrier film, method of manufacturing the chip carrier film and liquid crystal display using the chip carrier film

A chip carrier film comprising a terminal connecting pad portion provided on both ends of a surface of a base film, a semiconductor chip carrier region interposed between the terminal connecting pad portions on the ends, a first insulating film formed in a semiconductor chip carrier region on the surface of the base film, and a second insulating film formed in the semiconductor chip carrier region on a back face of the base film and having a different coefficient of curing shrinkage from that of the first insulating film.

A liquid crystal display device comprising a metal wiring formed on a surface of a base film, a first insulating film covering the metal wiring excluding a semiconductor chip connecting pad portion and a terminal connecting pad portion, a semiconductor chip connected to the semiconductor chip connecting pad portion of the metal wiring and mounted on the base film, a circuit board and a liquid crystal display panel which are connected to the terminal connecting pad portion of the metal wiring, and a second insulating film formed on a back face of the base film and having a different coefficient of curing shrinkage from that of the first insulating film.

The liquid crystal display device of any one of clams 17 to 18, wherein the terminal connecting pad portion should be provided on both ends of the base film, one of the ends of the terminal connecting pad portion should be connected to the circuit board and the other end of the terminal connecting pad portion should be connected to the liquid crystal display panel.