Flip-chip package and fabricating process thereof
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsTsung-Ming Pai, Shin-Shyan Hsieh
Life of this patent
Estimating the term…
Abstract
A flip-chip package is described. The flip-chip package includes a chip, a substrate, supporters and electrically conductive adhesive bumps. The electrically conductive adhesive bumps are located between the chip and the substrate electrically connecting the bonding pads on the former and the bump pads on the latter, wherein each electrically conductive adhesive bump has a smaller diameter at the central portion thereof than at the end portions thereof. The supporters are also disposed between the chip and the substrate surrounding the active area of the chip, so that the chip can be supported on the substrate.
Claims10
A flip-chip package, comprising at least:
- a chip having an active surface and bonding pads thereon, wherein the bonding pads are disposed on the active surface;
- a substrate having a carrying surface and bump pads thereon, wherein the bump pads are disposed on the carrying surface opposite to the bonding pads;
- a plurality of supporters disposed between the chip and the carrying surface and distributed at a periphery of the active surface;
- and
- a plurality of electrically conductive adhesive bumps, each connecting a bonding pad and a corresponding bump pad and having a smaller diameter at a central portion thereof than at end portions thereof.
A flip-chip packaging process, comprising at least the steps of:
- providing a chip and a substrate, wherein the chip has an active surface with bonding pads disposed thereon, and the substrate has a carrying surface with bump pads disposed thereon, wherein locations of the bump pads correspond to locations of the bonding pads;
- disposing a plurality of supporters at a periphery of the active surface, and forming an uncured electrically conductive adhesive bump on each bump pad;
- situating the chip over the carrying surface to contact the carrying surface via the supporters;
- pressing the chip toward the substrate to decrease the distance between the active surface and the carrying surface, so as to cause elastic strain in the supporters and increase a contact area between each pair of electrically conductive adhesive bump and bonding pad;
- stopping pressing the chip;
- and
- curing the electrically conductive adhesive bumps.
Dependencies are inferred from the claim text.