Semiconductor device package and method of making the same
AssigneeTexas Instruments Incorporated
InventorMuthiah Venkateswaran
Life of this patent
Estimating the term…
Abstract
A semiconductor device package and a method of making the same are provided. The semiconductor device includes a package substrate, a layer of conductive material, a group of channels, and a chip. The package substrate has a top layer. The top layer has a group of conductive vias formed therethrough. The conductive material layer is formed on the top layer of the package substrate. The group of channels are formed in the conductive material layer about at least some of the vias to define a group of contact pads on the vias. The chip is electrically coupled to the package substrate through the contact pads.
Claims25
A method of forming a package for an integrated circuit device, comprising:
- forming contact pads on a top layer of a package substrate;
- and
- forming a plate layer on the top layer of the package substrate, the plate layer being located in an area outside of the contact pads, the plate layer having a thickness about equal to a thickness of the pads.
A method of forming a package for an integrated circuit device, comprising:
- forming a layer of conductive material on a top layer of a package substrate;
- and
- removing a portion of the conductive material layer to form channels, each channel defining a corresponding contact pad surrounded by the channel, wherein each contact pad is formed from the conductive material layer, and wherein each channel is surrounded by a remaining portion of the conductive material layer outside of the channel.
A semiconductor device, comprising:
- a package substrate having a top layer, the top layer having a group of conductive vias formed therethrough;
- a layer of conductive material formed on the top layer of the package substrate;
- a group of channels formed in the conductive material layer about at least some of the vias to define a group of contact pads on the vias;
- and
- a chip electrically coupled to the package substrate through the contact pads.
Dependencies are inferred from the claim text.