Stackable ball grid array
AssigneeMicron Technology, Inc.
InventorsTodd O. Bolken, Cary J. Baerlocher, Chad A. Cobbley, David J. Corisis
Life of this patent
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Abstract
A stackable package to create a 3-dimensional memory array using ball grid array technology. Specifically, memory chips are coupled to a pre-formed packages which have alignment features to allow for the stacking of the ball grid arrays. The alignment features are used to align and orient each package with respect to an adjacent package, substrate or printed circuit board. The alignment features also support the weight of the adjacent package during solder ball reflow to maintain stack height and parallelism between packages. Each memory device is serially connected to the adjacent memory device through the vias and solder balls on each package.
Claims32
A memory package comprising:
- a plurality of vertically stacked ball grid arrays, wherein each of the plurality of ball grid arrays comprises a plurality of non-metal mateable alignment features, and wherein each of the plurality of ball grid arrays is coupled to another of the plurality of ball grid arrays;
- and
- a plurality of memory chips, wherein each of the plurality of memory chips coupled to a respective one of the plurality of ball grid arrays.
A device comprising:
- a chip;
- and
- a package operatively coupled to the chip, the package comprising:
- a die side;
- a ball side configured to receive a plurality of conductive balls;
- a plurality of first non-metal mateable alignment features on the die side of the package;
- and
- a plurality of second non-metal mateable alignment features on the second ball side of the package.
A package comprising:
- a die side configured to receive a die;
- a ball side configured to receive a plurality of conductive balls;
- a plurality of first non-metal mateable alignment features on the die side of the package;
- and
- a plurality of second non-metal mateable alignment features on the ball side of the package.
Dependencies are inferred from the claim text.