Die package
AssigneeMicron Technology, Inc.
InventorsEdmund Lua Koon Tian, Lim Thiam Chyc
Life of this patent
Estimating the term…
Abstract
Methods and structures for die packages are described. The die package includes an integrated circuit die connected to and elevated above a substrate. In an embodiment, wire bonds connects pads on the die to pads on the substrate. The substrate pads are closely adjacent the die due to the die support being positioned inwardly of the peripheral surface of the die. In an embodiment, the die support includes a paste that flows outwardly when connecting the die to the substrate. The outward paste flow extends from beneath the die support but does not extend outwardly of the die so as to not interfere or contact the substrate pads.
Claims66
A chip on board package, comprising:
- a ball grid array substrate;
- a die spaced from the substrate;
- a wire bond electrically connecting the die to the substrate;
- and
- a void extending intermediate the die and the substrate.
A chip on board package, comprising:
- a ball grid array substrate;
- a die;
- a support connecting the die to the substrate;
- a wire bond electrically connecting the die to the substrate;
- and
- a void extending intermediate the die and the substrate.
A chip on board package, comprising:
- a ball grid array substrate;
- a die having a bottom surface;
- an adhesive layer on the bottom surface;
- a support connecting the adhesive layer to the substrate;
- a wire bond electrically connecting the die to the substrate;
- and
- a void extending intermediate the die and the substrate.
A chip on board package, comprising:
- a ball grid array substrate having a first substrate surface with at least one first contact;
- a die having a first die surface with at least one second contact;
- a support connecting the die to the substrate, the support being inwardly spaced from the at least one first contact;
- at least one wire bond electrically connecting the at least one first contact to the at least one second contact;
- and
- a void extending intermediate the die and the substrate.
A chip on board package, comprising:
- a substrate having a first substrate surface with at least one first contact and a second substrate surface with at least one second contact;
- a die having a first die surface with at least one third contact;
- a support connecting the die to the substrate, the support being inwardly spaced from the at least one first contact;
- at least one wire bond electrically connecting the at least one first contact to the at least one third contact;
- and
- a void extending intermediate the die and the substrate and outwardly of the support.
A method, comprising:
- connecting a wire bond from a die to a substrate within an outer portion of the substrate, the outer portion having a width of about a half millimeter.
A method of connecting a die to a substrate, comprising:
- providing an adhesive on a surface of the die;
- providing a support on the adhesive;
- providing a paste on the substrate;
- positioning the support on the paste such that the paste remains completely beneath the die.
A method of connecting a die to a substrate, comprising:
- providing an adhesive on a surface of the die;
- providing a support on the adhesive;
- providing a paste on the support on its side free of the adhesive;
- pressing the die and support assembly onto the substrate while keeping the paste completely beneath the die.
A method of connecting a die to a substrate, comprising:
- providing an adhesive on a first surface of the die;
- providing a support on the adhesive;
- providing a paste on at least one of the support on its side free of the adhesive and a surface of the substrate;
- pressing the die and support assembly onto the substrate while keeping the paste completely beneath the die;
- wire bonding pads on a second surface of the die to contacts on the substrate;
- and
- encapsulating the die.
A method of connecting a die to a substrate, comprising:
- providing a substrate having contacts positioned less than about 0.38 millimeters outwardly from the die
- providing an adhesive on a first surface of the die;
- providing a support on the adhesive;
- providing a paste on at least one of the support on its side free of the adhesive and a surface of the substrate;
- pressing the die and support assembly onto the substrate while keeping the paste completely beneath the die;
- wire bonding pads on a second surface of the die to contacts on the substrate.
A method of forming a packaged integrated circuit, comprising:
- forming an integrated circuit in a die;
- fixing the die on a substrate, wherein fixing includes elevating the die above the substrate on a support, adhering the support to the substrate and limiting paste bleed-out to beneath the die;
- and
- electrically connecting the integrated circuit to the substrate.
A method of fabricating a chip-on-board package, comprising attaching a die to a substrate such that paste bleed-out remains beneath the die to either reduce package size or increase die size.
A method of packaging a die, comprising:
- providing a die having a first area;
- connecting a spacer having a second area to the die, wherein the second area is smaller than the first area;
- pasting the spacer to a substrate while keeping all of the paste beneath the die.
Dependencies are inferred from the claim text.