Heatsink arrangement for semiconductor device
AssigneeOnkyo Corporation
InventorsNorio Umezu, Sadatoshi Hisamoto, Kazutaka Murayama
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Abstract
A heatsink arrangement attached to a semiconductor device includes: a first heatsink placed in close contact with the semiconductor device; and second heatsink placed in close contact with the first heatsink, wherein the first heatsink and the second heatsink are connected to a power supply circuit for the semiconductor device via first connector and second connector, respectively. Thus, the present invention provides a heatsink arrangement for a semiconductor device used in an electric/electronic circuit that radiates less high-frequency noise even when a large current flows through the semiconductor device and that provides a high heat-radiating efficiency.
Claims10
A heatsink arrangement attached to a semiconductor device, comprising:
- a first heatsink placed in close contact with the semiconductor device;
- and
- a second heatsink placed in close contact with the first heatsink,
- wherein the first heatsink and the second heatsink are connected to a power supply circuit for the semiconductor device via first connector and second connector, respectively.
Dependencies are inferred from the claim text.