Semiconductor device with improved heat dissipation, and a method of making semiconductor device
AssigneeFujitsu Limited
InventorHideaki Yoshimura
Life of this patent
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Abstract
A semiconductor device includes a semiconductor chip, a heat dissipation member for dissipating heat generated by the semiconductor chip, and a coupling member which thermally couples the semiconductor chip to the heat dissipation member, wherein the coupling member is made of metal and deformable to absorb a stress generated between the semiconductor chip and the heat dissipation member, the coupling member and the semiconductor chip being joined through metal-metal bonding.
Claims12
A semiconductor device, comprising:
- a semiconductor chip;
- a heat dissipation member for dissipating heat generated by said semiconductor chip;
- and
- a coupling member which thermally couples said semiconductor chip to said heat dissipation member,
- wherein said coupling member is made of metal and deformable to absorb a stress generated between said semiconductor chip and said heat dissipation member, said coupling member and said semiconductor chip being joined through metal-metal bonding.
A method of making a semiconductor device, comprising the steps of:
- making a coupling member by forming posts on a substrate;
- forming a metal layer on a back surface of a semiconductor chip;
- pressing said posts against said metal layer while filling a resin material between said coupling member and said semiconductor chip, thereby joining said posts to said metal layer through metal-metal bonding.
A heat dissipation member made by a process comprising the steps of:
- forming a resist on a substrate;
- removing a portion or portions of said resist formed on the substrate in places where posts are to be formed;
- forming the posts on the substrate in said places where the resist is removed;
- forming a joint material on the posts;
- and
- removing the remaining resist on the substrate.
Dependencies are inferred from the claim text.