Module with adhesively attached heat sink
AssigneeInternational Business Machines Corporation
InventorsDavid J. Alcoe, Thomas W. Dalrymple, Michael A. Gaynes, Randall J. Stutzman
Life of this patent
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Abstract
A method and structure to adhesively couple a cover plate to a semiconductor device. A semiconductor device is electrically coupled to a substrate. A stiffener ring surrounding the semiconductor device is adhesively coupled to the substrate. A cover plate is adhesively coupled to both a top surface of the semiconductor device and a top surface of the stiffener ring using a first and second adhesive, respectively. The modulus of the first adhesive is less than the modulus of the second adhesive.
Claims20
An electronic structure, comprising:
- a substrate;
- a semiconductor device electrically coupled to the substrate;
- a stiffener ring adhesively coupled to the substrate, wherein the stiffener ring surrounds the semiconductor;
- and
- a cover plate on a top surface of the semiconductor and on a top surface of the stiffener ring, wherein the cover plate is adhesively coupled to a portion of the top surface of the semiconductor by a first adhesive, wherein the cover plate is adhesively coupled to a portion of a top surface of the stiffener ring by a second adhesive, and wherein a modulus of the first adhesive is less than a modulus of a second adhesive.
An electronic structure, comprising:
- a substrate;
- a semiconductor electrically coupled to the substrate;
- and
- a cover plate on a top surface of the semiconductor, wherein the cover plate is adhesively coupled to a portion of the top surface of the semiconductor by a first adhesive, and wherein the first adhesive has a modulus less than about 500 psi.
A method for forming an electronic structure, comprising:
- providing a semiconductor device;
- electrically coupling the semiconductor device to a substrate;
- adhesively coupling a stiffener ring to the substrate, wherein the stiffener ring surrounds the semiconductor device, and
- adhesively coupling a cover plate to a portion of a top surface of the semiconductor device with a first adhesive and to a portion of a top surface of the stiffener ring with a second adhesive, wherein a modulus of the first adhesive is less than a modulus of a second adhesive.
Dependencies are inferred from the claim text.