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US 2004/0164400 A1Published application
Electronic component having at least one semiconductor chip on a circuit carrier and method for producing the same
AssigneeInfineon Technologies AG
InventorGeorg Meyer-Berg
Life of this patent
Estimating the term…
Abstract
An electronic component includes at least one semiconductor chip, which has an active chip top side with contact areas and has a chip rear side arranged on a carrier top side of a circuit carrier. The circuit carrier and the chip top side are covered by a common rewiring layer having external contact areas at a different level. The different level is matched to a common level of external contact top sides by means of different heights of in part compliant external contacts.
Claims17
An electronic component, comprising:
- at least one semiconductor chip, the semiconductor chip including an active chip top side, a chip rear side and a plurality of contact areas arranged on the chip top side;
- a circuit carrier, the circuit carrier having a carrier top side;
- at least one patterned rewiring layer the rewiring layer having external contact areas;
- a plurality of external contacts arranged on the external contact areas;
- wherein the chip rear side is arranged on the carrier top side,
- the rewiring layer extends over the active chip top side and over the carrier top side, and
- the external contacts have heights, the heights being adapted to the level difference between chip top side and carrier top side, the chip top side having a first external contact top side, the carrier top side having a second external contact top side, the external contact top sides being disposed at a common level.
4 more elements
A system, comprising:
- a circuit carrier, the circuit carrier being made of metal and a plurality of semiconductor chips, the semiconductor chips having chip top sides and chip rear sides, the semiconductor chips being arranged with the chip rear side on a respective carrier top side, the semiconductor chips being electrically connected via a common rewiring layer among one another and to external contacts having different heights, the different heights of the external contacts levelling the level differences between the chip top sides and the carrier top side such that external contact top sides are disposed at a common level.
A method for producing electronic components, comprising:
- producing a wafer-type or rectangular circuit carrier, the circuit being made of metal with component positions arranged in rows and columns on a carrier top side;
- applying a first insulation layer;
- applying semiconductor chips in the component positions;
- applying a rubber-elastic material on the edge sides of the semiconductor chip, the rubber-elastic material being a transition between the chip top side and the circuit carrier top side covered with an insulation layer, with simultaneous formation of rubber-elastic external contact bodies for compliant external contacts;
- applying a rewiring layer with formation of conduction paths from top sides of the compliant external contacts to contact areas of the semiconductor chip and with formation of rewiring lines from contact areas of the semiconductor chip to external contact areas on that surface of the circuit carrier with insulation layer which is not covered by the semiconductor chip;
- applying outer external contacts having a different height with respect to a height of external contacts on the semiconductor chip as level equalization between chip top sides and carrier surface such that external contact top sides form a common level;
- and
- dividing the circuit carrier into individual components at the component positions.
5 more elements
A system, comprising:
- a circuit carrier, the circuit carrier being made of metal and a plurality of semiconductor chips, the semiconductor chips having chip top sides and chip rear sides, the semiconductor chips being arranged with the chip rear side on a semiconductor chip, the semiconductor chips being electrically connected via a common rewiring layer among one another and to external contacts having different heights, the different heights of the external contacts levelling the level differences between the chip top sides and the carrier top side such that external contact top sides are disposed at a common level.
Dependencies are inferred from the claim text.