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US 2004/0164390 A1Published application
[semiconductor package with a heat spreader]
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorSung-Fei Wang
Life of this patent
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Abstract
A semiconductor package with a heat spreader is described, including a first chip, a second chip, a heat spreader and a substrate. The first chip has an active surface over which the second chip is attached. The heat spreader is attached over the first chip. The first chip is bonded onto the substrate.
Claims25
A multi-chip module (MCM) packageheat spreader, comprising:
- a substrate having an opening;
- a plurality of first bumps;
- a first chip that has an active surface bonded to and electrically connected with the substrate through the first bumps, the active surface of the first chip facing the opening of the substrate;
- a plurality of second bumps;
- at least one second chip disposed in the opening of the substrate and bonded to the active surface of the first chip through the second bumps, the second chip being electrically connected to the first chip through the second bumps;
- and
- at least one heat spreader disposed in the opening of the substrate and bonded to the active surface of the first chip.
4 more elements
A multi-chip module (MCM) package with, comprising:
- a substrate having a cavity and a plurality of thermo-vias passing through the substrate, wherein each of the thermo-vias has one end exposed in the cavity;
- a plurality of first bumps;
- a first chip that has an active surface bonded to and electrically connected with the substrate through the first bumps, the active surface of the first chip facing to the cavity of the substrate;
- a plurality of second bumps;
- at least one second chip disposed in the cavity of the substrate and thermally connected with the thermo-vias of the substrate, and electrically bonded to the active surface of the first chip through the second bumps;
- and
- at least one heat spreader disposed in the cavity of the substrate and thermally connected with the thermo-vias of the substrate and the active surface of the first chip.
4 more elements
A multi-chip structure having a chip loaded with at least one other chip and at least one heat spreader, comprising:
- a first chip having an active surface;
- at least one second chip disposed on the active surface of the first chip;
- and
- at least one heat spreader disposed on the active surface of the first chip.
1 more element
Dependencies are inferred from the claim text.