[chip package and process for forming the same]
AssigneeVIA Technologies, Inc.
InventorI TSENG LEE
Life of this patent
Estimating the term…
Abstract
A chip package structure comprising a substrate, a chip, a plurality of bumps, a plurality of conductive wires and an insulating material is provided. The substrate has a first surface and a corresponding second surface. The substrate has a slot that penetrates the substrate. The chip is attached to the first surface of the substrate in a position that covers the slot. The conductive wires pass through the slot such that one end of each conductive wire is attached to a contact point on the chip while the other end of the conductive wire is attached to a contact point on the second surface of the substrate. The insulating material fills the space between the chip and the substrate and the slot so that the conductive wires and the bumps are enclosed.
Claims22
A chip package structure, comprising:
- a substrate having a first surface and a corresponding second surface, wherein the substrate has a slot that penetrates the substrate, the substrate having a plurality of substrate bump pads on the first surface positioned around the slot and a plurality of substrate wire pads on the second surface positioned around the slot;
- a chip having an active surface, wherein the sectional area of the active surface is larger than the sectional area of the slot in the substrate, the chip is attached to the first surface of the substrate and covers the slot such that the active surface faces the slot, the chip furthermore has a plurality of chip bump pads and a plurality of chip wire pads, wherein the chip wire pads are formed in the central region of the active surface and the chip bump pads are formed in the peripheral region of the active surface;
- a plurality of bumps, wherein one end of each bump is attached to a chip bump pad and the other end of the bump is attached to a substrate bump pad;
- a plurality of conductive wires that passes through the slot in the substrate, wherein one end of each conductive wire is attached to a chip wire pad and the other end is attached to a substrate wire pad;
- and
- an insulating material formed between the chip and the substrate and inside the slot so that the conductive wires and the bumps are enclosed.
A chip package structure, at least comprising:
- a substrate having a first surface and a corresponding second surface, wherein the substrate has a slot that penetrates the substrate;
- a chip attached to the first surface of the substrate and covering the slot;
- a plurality of bumps connecting the chip to the first surface of the substrate;
- a plurality of conductive wires that passes through the slot in the substrate, wherein one end of each conductive wire is attached to a contact point on the chip and the other end is attached to a contact point on the second surface of the substrate;
- and
- an insulating material formed between the chip and the substrate and inside the slot such that the conductive wires and the bumps are enclosed.
A method of forming a chip package, comprising the steps of:
- providing a substrate having a first surface and a corresponding second surface, wherein the substrate has a slot that penetrates the substrate;
- providing a chip having a plurality of bumps thereon;
- attaching the chip to the first surface of the substrate through the bumps so that the chip covers the slot;
- forming a first insulating material in the space between the chip and the substrate by an underfilling process such that the bumps are enclosed;
- forming a plurality of conductive wires that passes through the slot in the substrate such that one end of each conductive wire is attached to a contact point on the chip and the other end is attached to a contact point on the second surface of the substrate;
- and
- forming a second insulating material inside the slot by a molding process so that the conductive wires are enclosed.
A method of forming a chip package, comprising the steps of:
- providing a substrate having a first surface and a corresponding second surface, wherein the substrate has a slot that penetrates the substrate;
- providing a chip having a plurality of bumps thereon;
- attaching the chip to the first surface of the substrate through bumps so that the chip covers the slot;
- forming a plurality of conductive wires that passes through the slot in the substrate such that one end of each conductive wire is attached to a contact point on the chip and the other end is attached to a contact point on the second surface of the substrate;
- and
- forming an insulating material in the space between the chip and the substrate and inside the slot by a molding process so that the bumps and the conductive wires are enclosed.
Dependencies are inferred from the claim text.