Power semiconductor module
AssigneeInfineon Technologies AG
InventorThilo Stolze
Life of this patent
Estimating the term…
Abstract
The power semiconductor module (1) comprises several semiconductor components (6, 7, 8), located on a substrate (2). The aim of the invention is to prevent a reduction in the pressure of the substrate against a cooling surface and the resulting loss of cooling arising from deformations. Said aim is achieved, whereby the substrate (2) comprises several substrate regions (3, 4, 5), with one or several connection regions (31, 32), located between substrate regions (3, 4, 5), by means of which the substrate regions (3, 4, 5) are connected such as to move relative to each other.
Claims13
A power semiconductor module comprising a plurality of semiconductor components situated on a substrate, wherein
- the substrate has a plurality of substrate regions and
- one or a plurality of connecting regions are situated between substrate regions, via which connecting regions the substrate regions are connected such that they can move relative to one another.
Dependencies are inferred from the claim text.