Unmolded package for a semiconductor device
AssigneeFairchild Semiconductor Corporation
InventorRajeev Joshi
Life of this patent
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Abstract
A semiconductor device that does not include a molded body or package. The semiconductor device includes a substrate and a die coupled to the substrate. The die is coupled to the substrate such that the source and gate regions of the die, assuming a MOSFET-type device, are coupled to the substrate. Solder balls are provided adjacent to the die such that when the semiconductor device is coupled to a printed circuit board, the exposed surface of the serves as the drain connections while the solder balls serve as the source and gate connections.
Claims10
A semiconductor device comprising:
- a substrate;
- a die coupled to the substrate;
- and
- multiple solder balls coupled to the substrate adjacent the die, the solder balls being substantially coplanar with a surface of the die when the semiconductor device is coupled to a printed circuit board.
A method of packaging a semiconductor device, the method comprising:
- providing a substrate;
- providing a die;
- placing solder on at least one of the substrate and the die;
- flipping the die onto the substrate;
- and
- placing solder balls on the substrate adjacent the die.
A method of packaging a semiconductor device, the method comprising:
- providing a substrate;
- providing a die;
- simultaneously coupling the die to the substrate with solder and placing solder balls on the substrate adjacent the die;
- and
- reflowing the solder and solder balls.
Dependencies are inferred from the claim text.