US 2004/0164384 A1 · Surface excited device package including a substrate having a vibration-permitted cavity

Abstract

A surface excited device package and method for packaging a surface excited device provide a surface excited device having a small footprint, high reliability, low cost and high production volume. The surface excited device may be a Surface Acoustic Wave (SAW) device or a Micro Electromechanical System(MEMS) device. A substrate including multiple conductive patterns is bonded to a semiconductor die that includes a surface excited device area. The substrate includes multiple conductive patterns for connecting electrical connections of the die and terminals for connecting the surface excited device to external devices. The substrate further includes an aperture over the surface exited device area and a cover for covering the cavity formed by the aperture to protect the surface excited device area from the external environment.

Claims23

Dependent claims

A surface excited device, comprising:

a semiconductor die having substantially planar first and second surfaces, wherein the second surface includes a surface excited device area, and wherein the semiconductor die further includes a plurality of electrical terminals;
a substrate bonded to the second surface of the semiconductor die by an adhesive, wherein the substrate comprises a plurality of conductive patterns, and further defines a cavity having a predetermined height over the surface exited device area;
and
a plurality of conductive connectors for connecting the conductive patterns of the substrate to the electrical terminals of the semiconductor die.

1 more element

Dependencies are inferred from the claim text.

Surface excited device package including a substrate having a vibration-permitted cavity

Life of this patent

Surface excited device package including a substrate having a vibration-permitted cavity

Life of this patent

Abstract

Claims23